UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components (Великобритания (Англия, Шотландия, Уэльс) - Тендер #51448837) | ||
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Страна: Великобритания (Англия, Шотландия, Уэльс) (другие тендеры и закупки Великобритания (Англия, Шотландия, Уэльс)) Организатор тендера: UK Research & Innovation Номер конкурса: 51448837 Дата публикации: 17-02-2024 Источник тендера: Государственные закупки Уэльса (часть Соединённого Королевства Великобритании и Северной Ирландии) |
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| Title: | UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components |
| OCID: | ocds-h6vhtk-0422ea |
| Published by: | UK Research & Innovation |
| Authority ID: | AA80156 |
| Publication Date: | 16/02/2024 |
| Deadline Date: | |
| Deadline Time: | |
| Notice Type: | Contract Award Notice |
| Has Documents: | No |
| Has SPD: | No |
| Abstract: |
UK Research and Innovation"s (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components. |
Results of the procurement procedure
UK Research & Innovation
Polaris House, North Star Avenue
Swindon
SN2 1FL
UK
Contact person: STFC Procurement
Telephone: +44 1793442000
E-mail: STFCProcurement@ukri.org
NUTS: UKK14
Internet address(es)
Main address: www.ukri.org
Body governed by public law
Other: Research
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
II.1.2) Main CPV code31712000
II.1.3) Type of contractSupplies
II.1.4) Short descriptionUK Research and Innovation"s (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
II.1.6) Information about lotsThis contract is divided into lots: No
NUTS code:
UKJ14
Main site or place of performance:
Oxfordshire
II.2.4) Description of the procurementUK Research and Innovation"s (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
II.2.5) Award criteriaQuality criterion: Quality / Weighting: 70
Cost criterion: Price / Weighting: 30
II.2.11) Information about optionsOptions: No
II.2.13) Information about European Union fundsThe procurement is related to a project and/or programme financed by European Union funds: No
Open procedure
IV.1.8) Information about Government Procurement Agreement (GPA)The procurement is covered by the Government Procurement Agreement: No
Notice number in the OJ S:
2023/S 000-036273
A contract/lot is awarded: No
The contract/lot is not awarded
No tenders or requests to participate were received or all were rejected
To view this notice, please click here:
<a class=download_button rel=nofollow href="https://www.tenderguru.ru/registration?from=doc" >https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=842499336</a>
GO Reference: GO-2024215-PRO-25181972
UK Research & Innovation
Polaris House, North Star Avenue
Swindon
SN2 1FL
UK
Telephone: +44 1235446553
VI.4.2) Body responsible for mediation proceduresUK Research & Innovation
Science & Technology Facilities Council, Rutherford Appleton Laboratory, Harwell
Oxford
OX110QX
UK
Telephone: +44 1235446553
15/02/2024
Information added to the notice since publication.
Additional information added to the notice since it"s publication.| No further information has been uploaded. |
| Main Contact: | STFCProcurement@ukri.org |
| Admin Contact: | N/a |
| Technical Contact: | N/a |
| Other Contact: | N/a |
| ID | Title | Parent Category |
|---|---|---|
| 31712000 | Microelectronic machinery and apparatus and microsystems | Electronic equipment |
| ID | Description |
|---|---|
| 100 | UK - All |
The buyer has restricted the alert for this notice to suppliers based in the following regions.
Alert Region Restrictions| There are no alert restrictions for this notice. |