Miscellaneous special-purpose machinery (Германия - Тендер #45263404)

1. Section I
   1. Name and addresses
      Fraunhofer-Gesellschaft - Einkauf B12
      Hansastraße 27c
      München
      80686
      Germany
      E-mail: einkauf@zv.fraunhofer.de
      
   2. Joint procurement
      
   3. Communication
      The procurement documents are available for unrestricted and full direct access, free of charge, at
      https://vergabe.fraunhofer.de/NetServer/TenderingProcedureDetails?function=_Details&TenderOID=54321-Tender-189ff076aa6-6966c51ff21260de
      Additional information can be obtained from the abovementioned addresselectronically via: https://vergabe.fraunhofer.de
      
      
   4. Type of the contracting authority:
      Other type: Research Society e. V.
      
   5. Main activity:
      Other activity: Research and Development
      
2. Section II
   1. Scope of the procurement:
      1. Title:
         

         300 mm Wafer Electro Plating (ECD) Platform - PR431566-2480-W k

         Reference number: PR431566-2480-W k
         
      2. Main CPV code:
         42990000
         
      3. Type of contract:
         Supplies
         
      4. Short description:
         

         300 mm Wafer Electro Plating (ECD) Platform

      5. Estimated total value:
         
         
      6. Information about lots:
         This contract is divided into lots: no
   2. Description
      1. Title:
         
      2. Additional CPV code(s):
         
         
      3. Place of performance:
         Main site or place of performance:

         IPMS

         An der Bartlake 5

         01109 Dresden

      4. Description of the procurement:
         

         1 pc of 300 mm Wafer Electro Plating (ECD) Platform with options:

         5.5.1 Hardware Compatibility Options

         5.5.2 Precision Drive Head Upgrade Option

         5.5.3 Pre-Aligner Upgrade Option

         5.5.4 Dry Ring Upgrade Option

         5.5.5 Spin Rinse Dry Chamber Upgrade Option

         5.5.6 Further Chamber Upgrade Options

         5.5.7 Indium Plating Process for Wafer Level Packaging Applications:

         -5.2.10.1 General plating bath parameters

         -5.2.10.2 POR plating bath (wider range is better; (Inorganics & concentrations (g/L, ppm); Additive package & concentrations (mL/L)

         Plating Bath Temperature (°C): min, max, target; Electrolyte flow rate (L/min): min, max, target

         -5.2.10.3 WLP feature fill capability

         -5.2.10.4 Current set values

         -5.2.10.5 Current density

         -5.2.10.5 Plating steps

         -5.2.10.6 Film Thickness and Uniformity (100% open area, edge exclusion: 5 mm)

         -5.2.10.7 Sheet resistance (1000 nm Indium)

         -5.2.10.8 Wafer rotation (rpm): POR target, min, max

         -5.2.10.9 Paddle speed: POR target, min, max

         -5.2.10.10 Purity of plated Indium films

         -5.2.10.11 Film crystallinity Avg. grain size

         -5.2.10.12 Film crystallinity Preferred texture)

         -5.2.10.13 Film crystallinity Avg. Surface roughness (process of record)

         -5.2.10.14 Total POR process time per wafer

         5.6.1 Additive Dosing System

         5.6.2 Electrolyte Degassing System

         5.6.3 DI Prewet Degassing System

      5. Award criteria:
         Price is not the only award criterion and all criteria are stated only in the procurement documents
      6. Estimated value:
         
         
      7. Duration of the contract, framework agreement or dynamic purchasing system:
         Duration in months: 15
         This contract is subject to renewal: no
         
      8. Information about the limits on the number of candidates to be invited:
         
      9. Information about variants:
         Variants will be accepted: no
         
      10. Information about options:
          Options: yesDescription of options:

          5.5.1 Hardware Compatibility Options

          5.5.2 Precision Drive Head Upgrade Option

          5.5.3 Pre-Aligner Upgrade Option

          5.5.4 Dry Ring Upgrade Option

          5.5.5 Spin Rinse Dry Chamber Upgrade Option

          5.5.6 Further Chamber Upgrade Options

          5.5.7 Indium Plating Process for Wafer Level Packaging Applications:

          -5.2.10.1 General plating bath parameters

          -5.2.10.2 POR plating bath (wider range is better; (Inorganics & concentrations (g/L, ppm); Additive package & concentrations (mL/L)

          Plating Bath Temperature (°C): min, max, target; Electrolyte flow rate (L/min): min, max, target

          -5.2.10.3 WLP feature fill capability

          -5.2.10.4 Current set values

          -5.2.10.5 Current density

          -5.2.10.5 Plating steps

          -5.2.10.6 Film Thickness and Uniformity (100% open area, edge exclusion: 5 mm)

          -5.2.10.7 Sheet resistance (1000 nm Indium)

          -5.2.10.8 Wafer rotation (rpm): POR target, min, max

          -5.2.10.9 Paddle speed: POR target, min, max

          -5.2.10.10 Purity of plated Indium films

          -5.2.10.11 Film crystallinity Avg. grain size

          -5.2.10.12 Film crystallinity Preferred texture)

          -5.2.10.13 Film crystallinity Avg. Surface roughness (process of record)

          -5.2.10.14 Total POR process time per wafer

          5.6.1 Additive Dosing System

          5.6.2 Electrolyte Degassing System

          5.6.3 DI Prewet Degassing System

      11. Information about electronic catalogues:
          
          
      12. Information about European Union funds:
          The procurement is related to a project and/or programme financed by European Union funds: no
      13. Additional information:
          
3. Section III
   1. Conditions for participation:
      1. Suitability to pursue the professional activity, including requirements relating to enrolment on professional or trade registers:
         List and brief description of conditions:

         Directlink to documents with Selection criteria: (URL) https://vergabe.fraunhofer.de/NetServer/SelectionCriteria/54321-Tender-189ff076aa6-6966c51ff21260de

      2. Economic and financial standing:
         List and brief description of selection criteria:

         Directlink to documents with Selection criteria: (URL) https://vergabe.fraunhofer.de/NetServer/SelectionCriteria/54321-Tender-189ff076aa6-6966c51ff21260de

      3. Technical and professional ability:
         List and brief description of selection criteria:

         Directlink to documents with Selection criteria: (URL) https://vergabe.fraunhofer.de/NetServer/SelectionCriteria/54321-Tender-189ff076aa6-6966c51ff21260de

      4. Information about reserved contracts:
         
   2. Conditions related to the contract:
      1. Information about a particular profession:
         Contract performance conditions:

         In the event that subcontractors are used, they must be named and their suitability is likewise to be substantiated on the basis of the listed documents under III.1). Furthermore, it must be confirmed that they will be available if the order is placed; their share in the scope of the contractual object must be stated.

      2. Information about staff responsible for the performance of the contract:
         
4. Section IV
5. Description:
   1. Type of procedure:
      Competitive procedure with negotiation
   2. Information about a framework agreement or a dynamic purchasing system:
      
   3. Information about reduction of the number of solutions or tenders during negotiation or dialogue:
      
   4. Information about negotiation:
      
   5. Information about electronic auction:
      
   6. Information about the Government Procurement Agreement (GPA):
      The procurement is covered by the Government Procurement Agreement: yes
6. Administrative information:
   1. Previous publication concerning this procedure:
      
   2. Time limit for receipt of tenders or requests to participate:
      Date: 2023-09-18
      Local time: 10:00
      
   3. Estimated date of dispatch of invitations to tender or to participate to selected candidates:
      Date: 2023-09-22
      
   4. Languages in which tenders or requests to participate may be submitted:
      DE
   5. Minimum time frame during which the tenderer must maintain the tender:
      Tender must be valid until: 2023-12-21
      (from the date stated for receipt of tender)
      
   6. Conditions for opening of tenders:
      

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