Wafer metrology (Финляндия - Тендер #72094334) | ||
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Страна: Финляндия (другие тендеры и закупки Финляндия) Организатор тендера: Markkinaoikeus Номер конкурса: 72094334 Дата публикации: 29-04-2026 Источник тендера: Единая система закупок Европейского союза TED |
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Markkinaoikeus (ID: ORG-0001)
Address: Radanrakentajantie 5, Helsinki, 00520
Contacts:
Tel: +358 295643300
Email: markkinaoikeus@oikeus.fi
Web: http://www.oikeus.fi/markkinaoikeus
Company ID: 3006157-6
VTT Technical Research Centre of Finland Ltd (ID: ORG-0002)
Address: P.O. Box 1000, VTT, Espoo, 02044
Contacts:
Tel: +358 20722111
Email: kilpailutus@vtt.fi
Web: https://www.vttresearch.com/fi
Company ID: 2647375-4
Hansel Oy (Hilma) (ID: ORG-0003)
Address: Mannerheiminaukio 1a, Helsinki, 00100
Contacts:
Tel: 029 55 636 30
Email: tekninen@hankintailmoitukset.fi
Web: http://hankintailmoitukset.fi
Company ID: FI09880841
Description: The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Issue Date: 24.04.2026 00:00
Submission Deadline: 29.04.2026 06:00
CPV Codes: 38000000, 38300000
Documentation: