Cryogenic electron microscopy system with 300 kV transmission cryo-electron microscope and cryogenic focused ion beam scanning electron microscope (оригинал извещения) (Финляндия - Тендер #67746666) | ||
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Страна: Финляндия (другие тендеры и закупки Финляндия) Организатор тендера: Markkinaoikeus Номер конкурса: 67746666 Дата публикации: 15-10-2025 Источник тендера: Единая система закупок Европейского союза TED |
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Markkinaoikeus (ID: ORG-0001)
Address: Radanrakentajantie 5, Helsinki, 00520
Contacts:
Tel: +358 295643300
Email: markkinaoikeus@oikeus.fi
Web: http://www.oikeus.fi/markkinaoikeus
Company ID: 3006157-6
University of Helsinki (ID: ORG-0002)
Address: PL 3 (Fabianinkatu 33), University of Helsinki, 00014
Contacts:
Tel: +358 2941911
Email: hankinnat@helsinki.fi
Web: https://www.helsinki.fi/en
Company ID: 0313471-7
Hansel Oy (Hilma) (ID: ORG-0003)
Address: Mannerheiminaukio 1a, Helsinki, 00100
Contacts:
Tel: 029 55 636 30
Email: tekninen@hankintailmoitukset.fi
Web: http://hankintailmoitukset.fi
Company ID: FI09880841
Description: The Institute of Biotechnology Structural Biology Platform (INSTRUCT-HiLFE) will be upgrading its cryogenic electron microscopy (cryo-EM) services. The current 200 kV transmission electron microscope will be replaced with equipment offering higher resolution for both single-particle and tomography analysis. To enable this, we will establish an integrated workflow for producing samples for tomography and single-particle analysis. Specifically, we will acquire a 300 kV cryogenic transmission electron microscope (cryo-TEM) suitable for high-resolution structural biology, together with a software and hardware compatible cryogenic focused ion beam scanning electron microscope (cryo-FIBSEM) for lamella sample preparation required in high-resolution tomography. The instruments will be installed at the Institute of Biotechnology, University of Helsinki (UH). Delivery and installation will take place in 2027.
Issue Date: 13.10.2025 03:00
Submission Deadline: 15.10.2025 13:00
CPV Codes: 38510000
Documentation: