Huacai Tendering Group entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International
Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-04-02
1、Bidding Conditions
Overview:Procurement of Etching Equipment for the High-Voltage & High-Power Chip Production Capacity Improvement Project of Yandong Co., Ltd
Source of Funds:Implemented
Description of The Prepared Bidding Conditions:Already equipped
2、Bidding Content
Bidding No:1289-264026ZB0319
Project Name:Procurement of Etching Equipment for the High-Voltage & High-Power Chip Production Capacity Improvement Project of Yandong Co., Ltd
Place of Implementation:Beijing China
List of Products:
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NO.
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Product Name
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Quantity
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Main Technical Data
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Remarks
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1
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Etching Equipment
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One unit
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To realize the etching process in the manufacturing flow of 6-inch and 8-inch SiC products for semiconductor integrated circuits.
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3、Qualification Requirements For Bidder
Qualifications or Performance:1. The Bidder must have the capability to manufacture or refurbish the equipment subject to this tender. The Bidder or the manufacturer shall provide valid
after-sales service for the equipment in this bidding (specify the entity providing after-sales service to Yandong and its contact information).
2. The Bidder shall provide sales performance of not less than 10 units of relevant or similar equipment in the latest three years (from March 1, 2023 to the present). Copies of the sales
performance list, orders or contracts shall be submitted, which shall be affixed with the official company seal or signed by the authorized representative. If only the sales performance list
is provided, a commitment letter sealed with the official company seal shall be attached to ensure the authenticity of the contents.
3. The bidding product should be the bidder"s or its manufacturer"s own technical product. The bidding product may involve relevant patent content, and the bidder shall ensure that the
tenderer is not held responsible for identifying and infringing on these patents.
4. The target equipment must be newly manufactured equipment, please provide a "commitment letter".
5. Original or photocopy of the credit certificate issued by the bidder"s bank within three months prior to the bid opening date (with the bidder"s company seal affixed to the
photocopy);
6. Other qualification certification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-04-02
Ending of Selling Bidding Documents:2026-04-10
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:Room 1601, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Price of Bidding Documents:¥800/$115
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-04-23 10:00
Place of Bid:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Place of Bid Opening:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Co., Ltd
Add.:51 Jinghai Fourth Road, Beijing Economic and Technological Development Zone
Contact:Mr. Wang Yu
Tel:+86-10-50973000-8107
Bidding Agency:Huacai Tendering Group
Add.:Room 1601, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Contact:Ms. Jia Dongmin
Tel:010-63509799-8013/8029
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):