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Procurement of 4197-2540BOETRI03/06 BOE Technical Development Center Experimental Line Project(1) (Китайская Народная Республика - Тендер #71173557) | ||
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Страна: Китайская Народная Республика (другие тендеры и закупки Китайская Народная Республика) Номер конкурса: 71173557 Дата публикации: 10-03-2026 Источник тендера: www.chinabidding.com |
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Procurement of 4197-2540BOETRI03/06 BOE Technical Development Center Experimental Line Project(1)
| NO. | Product Name | Quantity | Main Technical Data | Remarks |
| 4197-2540BOETRI03/05 | 3D Print Repair equipment | 2 | The system is mainly used for【Repair of defective products in the printing process for metal circuits on the glass substrate edges and protective encapsulation materials for metal circuits】. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service. | CNY1500/USD250 |
| 4197-2540BOETRI03/06 | Automated Laser Black Film Cutting Equipment | 1 | Automatic laser film cutting equipment uses precise and reliable laser cutting technology to cut film materials into predefined shapes with high accuracy, minimal heat impact, and no defects such as adhesive residue. The equipment is required to have precision measurement and laser attenuation testing functions. The mechanical structure must be well-designed, incorporating advanced and mature technologies to ensure excellent dynamic performance of the system. The selected control system components must offer high precision, strong reliability, and fast response speed. The equipment should be user-friendly, easy to operate and maintain, aesthetically pleasing, and compact in structure. It must ensure stable and reliable overall operation while being backed by excellent after-sales service. | CNY1500/USD250 |
| 4197-2540BOETRI03/07 | Atomic Layer Etcher | 1 | This system is mainly used for GaN/AlGaN/AlN/AlGaInP/Silicon/SiOx/ITO etc. etching process of silicon based micro-LED display. Maker should provide all layer standard recipes and confirm the process stability. Transfer system of ALE Unit should be able to use normal 6 or 8 inch silicon/sapphire/glass etc. wafer. 8 inch wafer is notched, 6 inch wafer is flat. Transfer system of Plasma dicing Unit should be able to use 8 or 12 inch silicon wafer, which is notched. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service. | CNY3000/USD500 |