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Procurement of 4197-2540BOETRI03/07 BOE Technical Development Center Experimental Line Project(1) (Китайская Народная Республика - Тендер #71173556)


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Страна: Китайская Народная Республика (другие тендеры и закупки Китайская Народная Республика)
Номер конкурса: 71173556
Дата публикации: 10-03-2026
Источник тендера:


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Procurement of 4197-2540BOETRI03/07 BOE Technical Development Center Experimental Line Project(1)

2026-03-09
China Electronics Commerce (Beijing) Co., Ltd entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-03-09
1、Bidding Conditions
Overview:BOE Technical Development Center Experimental Line Project
Source of Funds:OK
Description of The Prepared Bidding Conditions:OK
2、Bidding Content
Bidding No:4197-2540BOETRI03/07
Project Name:BOE Technical Development Center Experimental Line Project
Place of Implementation:Beijing, P. R. China
List of Products:
NO. Product Name Quantity Main Technical Data Remarks
4197-2540BOETRI03/05 3D Print Repair equipment 2 The system is mainly used for【Repair of defective products in the printing process for metal circuits on the glass substrate edges and protective encapsulation materials for metal circuits】. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service. CNY1500/USD250
4197-2540BOETRI03/06 Automated Laser Black Film Cutting Equipment 1 Automatic laser film cutting equipment uses precise and reliable laser cutting technology to cut film materials into predefined shapes with high accuracy, minimal heat impact, and no defects such as adhesive residue. The equipment is required to have precision measurement and laser attenuation testing functions. The mechanical structure must be well-designed, incorporating advanced and mature technologies to ensure excellent dynamic performance of the system. The selected control system components must offer high precision, strong reliability, and fast response speed. The equipment should be user-friendly, easy to operate and maintain, aesthetically pleasing, and compact in structure. It must ensure stable and reliable overall operation while being backed by excellent after-sales service. CNY1500/USD250
4197-2540BOETRI03/07 Atomic Layer Etcher 1 This system is mainly used for GaN/AlGaN/AlN/AlGaInP/Silicon/SiOx/ITO etc. etching process of silicon based micro-LED display. Maker should provide all layer standard recipes and confirm the process stability. Transfer system of ALE Unit should be able to use normal 6 or 8 inch silicon/sapphire/glass etc. wafer. 8 inch wafer is notched, 6 inch wafer is flat. Transfer system of Plasma dicing Unit should be able to use 8 or 12 inch silicon wafer, which is notched. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service. CNY3000/USD500

3、Qualification Requirements For Bidder
Qualifications or Performance:Bidders are legal persons or other organizations who participate in bidding. This Invitation for Bids is open to all suppliers from within the People"s Republic of China (hereinafter abb. as "PRC") and all countries/areas which have regular trade relations with PRC. Bidders must pay for the bidding documents and register for the record, otherwise the bidder has no qualification to attend the bid.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-03-09
Ending of Selling Bidding Documents:2026-03-16
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China or CEC E-procurement Platform(https://www.cec-ec.com.cn)
Price of Bidding Documents:¥3000/$500
Additional Instructions:Specific time of Selling Bidding Documents:between 9:00 ~11:30 am and 13:00~16:30 pm (Beijing Time)(except holidays).The bidder should register on the website of CEC E-procurement Platform (https://www.cec-ec.com.cn) to purchasing and download the bidding documents.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-03-31 10:00
Place of Bid:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
Place of Bid Opening:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
6、Contact Details
Purchasers:BOE
Add.:NO.9, Dize Rd, BDA,Beijing, 100176, China
Contact:Mr. Li
Tel:86-10-57675680
Bidding Agency:China Electronics Commerce (Beijing) Co., Ltd
Add.:Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
Contact:Mr. Liu, Mr Zhuang, Ms. Chang, Ms.Liu
Tel:86-10-52200340 (Sell bidding documents), 86-10-52203401
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):


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