Procurement of 0618-254TC250204X/04 Chip flip chip bonding machine(2) (Китайская Народная Республика - Тендер #63116301)

Procurement of 0618-254TC250204X/04 Chip flip chip bonding machine(2)

2025-04-16

【Buy Bidding Documents】

China CNTC International Tendering Corporation entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2025-04-16
1、Bidding Conditions
Overview:Chip flip chip bonding machine
Source of Funds:Implemented
Description of The Prepared Bidding Conditions:Implemented
2、Bidding Content
Bidding No:0618-254TC250204X/04
Project Name:Chip flip chip bonding machine
Place of Implementation:XIAN
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:Please refer to the Chinese announcement
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-04-16
Ending of Selling Bidding Documents:2025-04-23
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Please refer to the Chinese announcement
Price of Bidding Documents:￥800/$150
Additional Instructions:Please refer to the Chinese announcement
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-05-07 09:00
Place of Bid:Please refer to the Chinese announcement
Place of Bid Opening:Please refer to the Chinese announcement
6、Contact Details
Purchasers:XIAN ELECTRONIC ENGINEERING RESEARCH INSTITUTE
Add.:XIAN
Contact:MR.WANG
Tel:13087561787
Bidding Agency:China CNTC International Tendering Corporation
Add.:BEIJING
Contact:LI
Tel:010-62108104
7、Remittance Approach:
Bank(RMB):Industrial And Commercial Bank Of China Ltd, Beijing Haidian Subbranch Business Department
Bank(USD):Bank of China, Head Office, Banking Department
Account NO.(RMB):0200049619200362296
Account NO.(USD):778350014863

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