Procurement of 0722-254YDZB01ZB2/02 8-inch Wafer Dicing Machine and 8-inch Wafer Inspection Machine(1) (Китайская Народная Республика - Тендер #63106386)

Procurement of 0722-254YDZB01ZB2/02 8-inch Wafer Dicing Machine and 8-inch Wafer Inspection Machine(1)

2025-04-15

【Buy Bidding Documents】

China Far East International Tendering Co.,LTD entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2025-04-15
1、Bidding Conditions
Overview:package 02:
item 1:8-inch Wafer Dicing Machine 2
item 2:8-inch Wafer Inspection Machine 2
Source of Funds:arranged.
Description of The Prepared Bidding Conditions:The conditions for bidding have been fulfilled.
2、Bidding Content
Bidding No:0722-254YDZB01ZB2/02
Project Name:8-inch Wafer Dicing Machine and 8-inch Wafer Inspection Machine
Place of Implementation:China Shanxi
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:(1)Any bidder from within the People"s Republic of China or from countries and regions that have normal trade relations with the People"s Republic of China is eligible to participate in the bidding. For bidders that are companies outside the Chinese customs territory, they must provide the registration materials of their place of registration. For bidders that are companies within the Chinese customs territory, they must provide a valid business license of an enterprise legal person. (2)Accept the bid of the manufacturer or agent. If you bid for the agent, you need to provide the original power of attorney issued by the manufacturer.
(3)The bidder needs to have the equipment technical support and service capabilities necessary to fulfil the contract (providing supporting materials or letters of commitment, and the format of the letter of commitment is self-made).
(4)The bidder must provide the original or a copy of the original credit certificate issued by his account opening bank within three months before the opening date.
(5)Performance Requirements: 8-inch Wafer Dicing Machine : The domestic installation record of the same series of slicing machines in 8-inch semiconductor wafer manufacturing plants (excluding silicon wafer factories, research institutions, universities, etc.) for thin wafer applications is ≥ 40 units. 8-inch Wafer Inspection Machine: The domestic installation record of the same series of fully automatic wafer loading and unloading visual inspection machines in 8/12-inch semiconductor wafer manufacturing plants (excluding silicon wafer factories, research institutions, universities, etc.) for thin wafer applications is ≥ 30 units.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-04-15
Ending of Selling Bidding Documents:2025-04-22
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Email(luowen@cfet.com.cn)
Price of Bidding Documents:￥1500/$200
Additional Instructions:Materials to be provided when purchasing bidding documents: (1) A copy of the business license (stamped with the official seal of the bidder"s unit). (2) If purchased by the legal representative, please present the identity certificate of the legal representative and a copy of the identity card of the legal representative (stamped with the official seal of the bidder"s unit); if purchased by the illegal representative, please present the identity certificate of the legal representative and a copy of the power of attorney of the legal representative (be stamped with the bid The official seal of the person"s unit). The registration materials are only used for registration review, not as a basis for follow-up review
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-05-07 09:00
Place of Bid:Shanxi Electronic Chip Industry Era Technology Co., Ltd, Smart Center, Core Area of Electronic Valley, about 150 meters northwest of the intersection of Xiaohe North Road and Cuiwei Road, Chang"an District, Xi"an City, Shaanxi Province, China
Place of Bid Opening:Shanxi Electronic Chip Industry Era Technology Co., Ltd, Smart Center, Core Area of Electronic Valley, about 150 meters northwest of the intersection of Xiaohe North Road and Cuiwei Road, Chang"an District, Xi"an City, Shaanxi Province, China
6、Contact Details
Purchasers:Shanxi Electronic Chip Industry Era Technology Co., Ltd
Add.:A2 101-1, Phase I, Bonded Warehouse North of Comprehensive Third Road, Comprehensive Insurance Zone, High-tech Zone, Xi"an City, Shaanxi Province
Contact:Liu Le
Tel:029-85727929
Bidding Agency:China Far East International Tendering Co.,LTD
Add.:A2 101-1, Phase I, Bonded Warehouse North of Comprehensive Third Road, Comprehensive Insurance Zone, High-tech Zone, Xi"an City, Shaanxi Province
Contact:Luo Wen,Hu Cheng
Tel:13161011216、15801683957
7、Remittance Approach:
Bank(RMB):Beijing Heping Street Branch of Industrial and Commercial Bank of China
Bank(USD):
Account NO.(RMB):0200205319200005445
Account NO.(USD):
8、Additional Instruction
Additional Instructions:This project is implemented on the CHINA INTERNATIONAL BIDDING and Bindlink. Bidders shall successfully register on the CHINA INTERNATIONAL BIDDING ( http://www.chinabidding.com/) and Bindlink( http://www.ebnew.com/) before the deadline for purchasing the bidding documents specified in the bidding documents, taking the criterion that the bidding agency can select the bidders as the purchasers of the bidding documents.Otherwise, the bidders will not be able to enter the bidding process, and they shall bear the consequences arising therefrom by themselves. The bid evaluation results will be publicly announced on Bindlink and the CHINA INTERNATIONAL BIDDING ( http://chinabidding.mofcom.gov.cn/

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