NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. (Ангилья - Тендер #45368523)

• Prior information notice

This notice is for prior information only

Section I: Contracting authority I.1) Name and addresses

University of Strathclyde

McCance Building, 16 Richmond Street

Glasgow

G1 1QE

UK

Telephone: +44 7811592949

E-mail: jemma.wylie@strath.ac.uk

NUTS: UKM82

Internet address(es)

Main address: http://www.strath.ac.uk/

Address of the buyer profile: https://www.publiccontractsscotland.gov.uk/search/Search_AuthProfile.aspx?ID=AA00113

I.2) Joint procurement

The contract is awarded by a central purchasing body

I.3) Communication

Additional information can be obtained from the abovementioned address

I.4) Type of the contracting authority

Body governed by public law

I.5) Main activity

Education

Section II: Object II.1) Scope of the procurement II.1.1) Title

NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

Reference number: UOS-29683-2023

II.1.2) Main CPV code

31712330

II.1.3) Type of contract

Supplies

II.1.4) Short description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

II.1.5) Estimated total value

Value excluding VAT: 1 900 000.00 GBP

II.1.6) Information about lots

This contract is divided into lots: No

II.2) Description II.2.2) Additional CPV code(s)

31710000

II.2.3) Place of performance

NUTS code:

UKM82

II.2.4) Description of the procurement

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements.

The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells.

The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability:

Cell 6: Die Attach

- Automatic die bonding

- Vacuum oven curing

- Plasma cleaning

Cell 7: Interconnection

- Multi-head wire bonding

- Ultrasonic bonding

Cell 8: Encapsulation

- Overmoulding

- Dam and fill encapsulation

- Oven curing

II.3) Estimated date of publication of contract notice:

02/10/2023

Section IV: Procedure IV.1) Description IV.1.8) Information about Government Procurement Agreement (GPA)

The procurement is covered by the Government Procurement Agreement: Yes

Section VI: Complementary information VI.3) Additional information

NOTE: To register your interest in this notice and obtain any additional information please visit the Public Contracts Scotland Web Site at https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=742450.

(SC Ref:742450)

VI.5) Date of dispatch of this notice

23/08/2023

Information added to the notice since publication.

Additional information added to the notice since it"s publication. Commodity Categories Commodity Categories
Delivery Locations Delivery Locations
Alert Region Restrictions

The buyer has restricted the alert for this notice to suppliers based in the following regions.

Alert Region Restrictions

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