Circuit Design of the Application Test Chip for Low-cost Die-to-Die Interface 1 Set (Япония - Тендер #66182849) | ||
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Страна: Япония (другие тендеры и закупки Япония) Организатор тендера: Government Procurement Japan Номер конкурса: 66182849 Дата публикации: 12-08-2025 Источник тендера: Государственные закупки Японии |
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This procurement is covered by the WTO Agreement on Government Procurement, Japan-EU Economic Partnership Agreement or Japan-UK Comprehensive Economic Partnership Agreement.
Publishing date | Aug 12, 2025 |
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Type of notice | Notice of Procurement (Goods & Services) |
Procurement entity | National University Corporation - Tokyo |
Classification | 0027 Computer Services 0071 Computer & Related Services |
Summay of notice |
⑴, ⑻, ⑼ The same with the Notice above (No.25) ⑵ Classification of the services to be procured : 71, 27 ⑶ Nature and quantity of the services to be required : Circuit Design of the Application Test Chip for Low-cost Die-to-Die Interface 1 Set ⑷ Fulfillment period : By 19 March, 2026 ⑸ Fulfillment place : The places specified by the University of Tokyo ⑹ Qualifications for participating in the tendering procedures : Suppliers eligible for participating in the proposed tender are those who shall : ADE The same with the Notice above (No.25) B have the Grade A, Grade B or Grade C qualification during fiscal 2025 in the Kanto-Koshinetsu area in offer of services for participating in tenders by Single qualification for every ministry and agency, C prove to have prepared a system to provide rapid after-sale service for the procured services, ⑺ Time limit of the documents : 17 : 00 8 September, 2025 |