Nondestructive Solar Cell Scribing Machine (Индия - Тендер #69588831)

• Date Posted: 2025-12-30 00:10 From English Site
• Valid to:2026-03-20
• Purchase Quantity: 1 Piece(s)
• Trade Terms:FOB
• Payment Terms:T/T
• Sourcing Request From:Request From: India
• Shipping Method:Sea freight
• Quote Now Quote Left: 10 Product Description Buyer Business Info. Name: Non-destructive Solar Cell Scribing Machine Dual-line
  Function: Fully automated equipment for non-destructive cutting and dicing of photovoltaic solar cells
  Process Flow: Includes feeding laminated boxes, CCD detection, laser scribing, cracking and drying, and final box loading
  
  2. Key Features
  Non-destructive Technology: Produces smooth cross-sections without cracks, improving cell strength and packaging yield
  High Efficiency:
  Production capacity: 7200 to 7600 pieces per hour
  Uptime: 98 percent or higher
  Low damage rate: Fragment ratio less than or equal to 0.03 percent
  Advanced Control: Dual-line A/B slicing platform for continuous operation and CCD vision system for accurate positioning and inspection
  Configuration: Uses high-quality components including Hiwin or THK lead screws, SMC or AirTAC valves, and Xinje PLC and servo systems
  
  3. Technical Requirements for Quotation
  Cell Compatibility: 166 mm X 166 mm to 230 mm X 230 mm standard half-piece dicing
  Cell Types: Supports P-type and N-type single or double-sided wafers and heterojunction cells
  Thickness Range: 120 micrometers to 220 micrometers
  Facility Requirements:
  Power: 380V, 50Hz, three-phase five-wire, peak power 20 kW, average 12 kW
  Compressed air: 0.5 to 0.8 MPa, 800 to 1000 liters per minute
  Environment: Operating temperature 25 degrees Celsius plus or minus 10 degrees, humidity below 65 percent
  
  
  Supplier Quotation Request
  Subject: Request for Quotation NDC Machine
  
  We are interested in purchasing a dual-line fully automated non-destructive solar cell scribing machine. Please provide a formal quotation based on the following requirements:
  
  Minimum capacity of 7200 pieces per hour with fragment rate less than or equal to 0.03 percent
  Ability to process single crystal wafers from 166 mm to 230 mm and thickness from 120 to 220 micrometers
  Standard half-piece dicing setup and dual-line interactive platform included
  Optional pricing for:
  Scan code for incoming materials
  MES interface support
  Confirmation that Hiwin or THK and SMC or AirTAC components are included as per standard configuration
  
  Please include the following in your quotation:
  Unit price and lead time
  Installation and commissioning terms installation typically required within 48 hours of notice
  Warranty details and technical training arrangements Please sign in to view buyer business information if you are Premium Member.

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