Procurement of 0610-2642IH010398 Procurement of High Temperature Diffusion Furnace Equipment for 12-inch Semiconductor IC Wafer of YDMT(2) (Китайская Народная Республика - Тендер #71480347)

Procurement of 0610-2642IH010398 Procurement of High Temperature Diffusion Furnace Equipment for 12-inch Semiconductor IC Wafer of YDMT(2)

2026-03-25

【Buy Bidding Documents】

Beijing International Tendering Co.,Ltd. entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-03-25
1、Bidding Conditions
Overview:Procurement of High Temperature Diffusion Furnace Equipment for 12-inch Semiconductor IC Wafer of YDMT
Source of Funds:Self-raised funds , and have been raised
Description of The Prepared Bidding Conditions:Bidding Conditions have been met
2、Bidding Content
Bidding No:0610-2642IH010398
Project Name:Procurement of High Temperature Diffusion Furnace Equipment for 12-inch Semiconductor IC Wafer of YDMT
Place of Implementation:Bidding Conditions have been met
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:1. The manufacturer of the bidder shall have a sales performance of at least 30 units of relevant or simi
lar 12 inch equipment in the past 3 years (from March 1, 2023 to present), and shall provide a sales list or copies of orders or contracts
stamped with official seals or signed by authorized persons. 2. The bidder or the bidder"s manufacturer can provide effective after-sales ser
vice for the bidding equipment (the unit and contact information that provides after-sales service to Yandong). 3. The bidding product sh
ould be the bidder"s manufacturer"s own technical product. The bidding product may involve relevant patent content, and the bidder shall e
nsure that the tenderer is not held responsible for identifying and infringing on these patents. 4. Original or photocopy of the credit certificat
e issued by the bidder"s bank within three months prior to the bid opening date (with the bidder"s company seal affixed to the photocop
y). 5. Other qualification certification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-03-25
Ending of Selling Bidding Documents:2026-04-01
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Room 509, Beijing International Tendering Co., Ltd.
Price of Bidding Documents:￥1000/$150
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-04-21 10:00
Place of Bid:Room 305, Beijing International Tendering Co., Ltd.
Place of Bid Opening:Room 305, Beijing International Tendering Co., Ltd.
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Technology Co., Ltd.
Add.:No. 51 Jinghai Fourth Road, Yizhuang Development Zone, Beijing
Contact:Mr. Wang Yu
Tel:Mr. Wang Yu
Bidding Agency:Beijing International Tendering Co.,Ltd.
Add.:No.71 Beixiaojie (North Alley), Chaoyangmen, Dongcheng District, Beijing, P.R. China (100010)
Contact:Ms. Li Yan
Tel:010-84046625;liyan02@zgcgroup.com.cn
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):

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