Procurement of 1354-264HXZBG2601 MCL Electronic Materials (Zhengzhou) Co., Ltd. 3.6 million pieces of 8-inch semiconductor special silicon polished waf project AP back sealing furnace procurement(1) (Китайская Народная Республика - Тендер #71130621)

Procurement of 1354-264HXZBG2601 MCL Electronic Materials (Zhengzhou) Co., Ltd. 3.6 million pieces of 8-inch semiconductor special silicon polished waf project AP back sealing furnace procurement(1)

2026-03-06

【Buy Bidding Documents】

hengxinzixunguanliyouxiangongsi entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-03-06
1、Bidding Conditions
Overview:MCL Electronic Materials (Zhengzhou) Co., Ltd. purchased 3 sets of AP back seal furnaces.
Source of Funds:Funded
Description of The Prepared Bidding Conditions:Fulfilled
2、Bidding Content
Bidding No:1354-264HXZBG2601
Project Name:MCL Electronic Materials (Zhengzhou) Co., Ltd. 3.6 million pieces of 8-inch semiconductor special silicon polished waf project AP back sealing furnace procurement
Place of Implementation:Henan Province, China
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:Qualifications or Performance:
(1)For foreign and overseas enterprises, a copy of the relevant documents issued in accordance with the laws of the country (region) the bidder is registered shall be provided; for domestic enterprises or other organizations, a copy of the business license of the enterprise legal person or other organization proof materials shall be provided.
(2)If the goods provided by the bidder in accordance with the contract are not manufactured by the bidder itself, the bidder shall obtain the original exclusive formal authorization the manufacturer of the goods to provide the goods in this bid, and the format can be referred to the first volume of the fourth chapter of the bidding documents; if the manufacturer particip in the bidding, the manufacturer shall not authorize the agent to participate in the bidding again.
(3) Performance requirements: The equipment provided by the bidder shall be mature reliable, advanced in technology, and there are already the same type of products operating stably under the same and similar factory conditions in China or abroad. Provide a performance record of more 10 units of the same type of equipment since January 1, 2018 (provide contracts or performance summary tables or acceptance certificates, if the supplier cannot provide contracts and other documents due to confidentiality reasons, it can be based on the supplier"s valid commitment or a copy of the contract that masks the customer"s key information. The industry is noted in the performance summary table); the performance in this document refers to the performance of the products signed by the bidder or the manufacturer.
(4) Original photocopy of the bank credit certificate issued by the bidder"s opening bank within three months before the bid opening date.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-03-06
Ending of Selling Bidding Documents:2026-03-13
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:6th floor, Block B, Building 16, Henan National University Science Park (East), Dianchang Road, Zhengzhou city.
Price of Bidding Documents:￥1000/$150
Additional Instructions:This project can also accept documents by email. Bidders need to send copies of relevant documents registered by the main manufacturer"s address or the business of the legal person of the enterprise or other organizational proof materials to the bidding agency"s mailbox (hxzx04@163.com), indicating the project and number, the contact person and the contact phone number, and pay the bidding document fee in time (please note:MCL AP back seal furnace project document fee), the for obtaining the bidding documents is 17:00 p.m. on March 13th ,2026.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-03-30 10:00
Place of Bid:Hengxin Consulting Management Co., Ltd. (Room B6, No.16 Building, East District, Zhengzhou City Power Plant Road National Science and Technology Park, Henan Province)
Place of Bid Opening:Hengxin Consulting Management Co., Ltd. (Room B6, No.16 Building, East District, Zhengzhou City Power Plant Road National Science and Technology Park, Henan Province)
6、Contact Details
Purchasers:MCL Electronic Materials (Zhengzhou) Co.,Ltd.
Add.:Southwest corner of the intersection of Fengxiang Street and Jinbai Road, Zhengzhou High-tech Industrial Development Zone, Zhengzhou City
Contact:Mr. Lv
Tel:+86-15138773396
Bidding Agency:hengxinzixunguanliyouxiangongsi
Add.:6th floor, block B, building 16, Henan national university science and technology park (east), Dianchang road, Zhengzhou city, Henan province
Contact:Ms. Wang & Ms. Li & Ms.Tian
Tel:+86-371-55131206
7、Remittance Approach:
Bank(RMB):China Construction Bank, Zhengzhou Huaqiang City Square Sub-branch
Bank(USD):Bank of Communications, Henan branch.
Account NO.(RMB):41050167283900000062
Account NO.(USD):411626999141000005780
Additional:(USD Account)swift:COMMCNSHZHE
8、Additional Instruction
Additional Instructions:Prior to submitting bids, bidders shall complete registration and information verification on either Ebnew (https://www.ebnew.com) or the Electronic Trading Platform for Bidding and Tendering of Mechanical and Electrical Products (https://www.chinabidding.com). The tender notice and bid evaluation results of this project will be published on China International Tendering Network, Bidding Network, Electronic Trading Platform for Mechanical and Electrical Producendering and Bidding, and Yuxin e-Procurement Platform.

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