Beijing International Tendering Co.,Ltd. entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of
International Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-03-05
1、Bidding Conditions
Overview:Procurement of Chemical Vapor Deposition and Rapid Heat Treatment Equipment of 12-inch Semiconductor IC Wafer of YDMT
Source of Funds:Self-raised funds , and have been raised
Description of The Prepared Bidding Conditions:Bidding Conditions have been met
2、Bidding Content
Bidding No:0610-2642IH010244
Project Name:Procurement of Chemical Vapor Deposition and Rapid Heat Treatment Equipment of 12-inch Semiconductor IC Wafer of YDMT
Place of Implementation:Beijing, P.R. China
List of Products:
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NO.
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Product Name
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Quantity
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Main Technical Data
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Remarks
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Procurement of Chemical Vapor Deposition and Rapid Heat Treatment Equipment of 12-inch Semiconductor IC Wafer of YDMT
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4 sets
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High density plasma chemical vapor deposition equipment: To achieve the filling process of trench or gap isolation materials in the manufacturing process of 12 inch silicon wafers for
semiconductor integrated circuits. Rapid heat treatment equipment: To achieve rapid heat treatment process in the manufacturing process of 12 inch silicon wafers for semiconductor
integrated circuits.
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0610-2642IH010244
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3、Qualification Requirements For Bidder
Qualifications or Performance:1. The bidder or the bidder"s manufacturer must have the ability to produce the equipment for this biddi
ng. The bidder or the bidder"s manufacturer shall provide a supply performance of no less than 20 units of the same or similar equipment fr
om February 1, 2023 to present, and shall provide a list of performance, contracts, orders, acceptance certificates, or other relevant suppor
ting documents. If only a performance list is provided, the authorized person"s signature is required to ensure authenticity. 2. The bidder or t
he bidder"s manufacturer can provide effective after-sales service for the bidding equipment (the unit and contact information that provide
s after-sales service to Yandong). 3. The subject equipment is new and not refurbished. 4. The bidding product may involve relevant pate
nt content, and the bidder will agree on the scope of intellectual property liability in future contracts (such as winning the bid). 5. Original
or photocopy of the credit certificate issued by the bidder"s bank within three months prior to the bid opening date. 6. Other qualification cer
tification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-03-05
Ending of Selling Bidding Documents:2026-03-12
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:Room 509, Beijing International Tendering Co., Ltd.
Price of Bidding Documents:¥4000/$600
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-04-10 10:00
Place of Bid:Room 509, Beijing International Tendering Co., Ltd.
Place of Bid Opening:Room 509, Beijing International Tendering Co., Ltd.
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Technology Co., Ltd.
Add.:No. 51, Jinghai Silu, Economic and Technological Development Zone of Beijing
Contact:Mr. Wang Yu
Tel:+86-10-50973000-8107
Bidding Agency:Beijing International Tendering Co.,Ltd.
Add.:No.71 Beixiaojie (North Alley), Chaoyangmen, Dongcheng District, Beijing, P.R. China (100010)
Contact:Ms. Li Yan
Tel:010-84046625;liyan02@zgcgroup.com.cn
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):