Beijing International Tendering Co.,Ltd. entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of
International Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-02-28
1、Bidding Conditions
Overview:Procurement of metal etching equipment for 12-inch Semiconductor IC Wafer of YDMT
Source of Funds:Self-raised funds , and have been raised
Description of The Prepared Bidding Conditions:Bidding Conditions have been met
2、Bidding Content
Bidding No:0610-2642IH010241
Project Name:Procurement of metal etching equipment for 12-inch Semiconductor IC Wafer of YDMT
Place of Implementation:Beijing, P.R. China
List of Products:
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NO.
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Product Name
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Quantity
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Main Technical Data
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Remarks
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Procurement of metal etching equipment for 12-inch Semiconductor IC Wafer of YDMT
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1 set
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This equipment is mainly used for dry etching of 300mm wafer metal film
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0610-2642IH010241
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3、Qualification Requirements For Bidder
Qualifications or Performance:1. The bidder must have the ability to produce the equipment for this bidding. The bidder should provid
e delivery performance of no less than 10 sets of 12 inch equipment that is the same or similar to this bidding from November 1, 2022 to pr
esent. 2. The bidder is able to provide effective after-sales service for the bidding equipment (including the unit and contact information th
at provides after-sales service to Yandong). 3. The target equipment must be brand new, please provide a "commitment letter". 4. The bid
ding product should be the bidder"s own technical product. The bidding product may involve relevant patent content, and the bidder shall e
nsure that the tenderer is not held responsible for identifying and infringing on these patents. 5. Original or photocopy of the credit certificat
e issued by the bidder"s bank within three months prior to the bid opening date (with the bidder"s company seal affixed to the photocop
y). 6. Other qualification certification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-02-28
Ending of Selling Bidding Documents:2026-03-06
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:Room 509, Beijing International Tendering Co., Ltd.
Price of Bidding Documents:¥2000/$300
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-03-24 10:00
Place of Bid:Room 305, Beijing International Tendering Co., Ltd.
Place of Bid Opening:Room 305, Beijing International Tendering Co., Ltd.
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Technology Co., Ltd.
Add.:No. 51, Jinghai Silu, Economic and Technological Development Zone of Beijing
Contact:Mr. Wang Yu
Tel:+86-10-50973000-8107
Bidding Agency:Beijing International Tendering Co.,Ltd.
Add.:No.71 Beixiaojie (North Alley), Chaoyangmen, Dongcheng District, Beijing, P.R. China (100010)
Contact:Ms. Li Yan
Tel:010-84046625;liyan02@zgcgroup.com.cn
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):