Procurement of 1289-264026ZB0136 Procurement of Defect Scanning Equipment for the High-Voltage and High-Power Chip Capacity Improvement Project of Yandong Co., Ltd.(1) (Китайская Народная Республика - Тендер #70686900)

Procurement of 1289-264026ZB0136 Procurement of Defect Scanning Equipment for the High-Voltage and High-Power Chip Capacity Improvement Project of Yandong Co., Ltd.(1)

2026-02-12

【Buy Bidding Documents】

Huacai Tendering Group entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-02-12
1、Bidding Conditions
Overview:Procurement of Defect Scanning Equipment for the High-Voltage and High-Power Chip Capacity Improvement Project of Yandong Co., Ltd.
Source of Funds:Implemented
Description of The Prepared Bidding Conditions:Already equipped
2、Bidding Content
Bidding No:1289-264026ZB0136
Project Name:Procurement of Defect Scanning Equipment for the High-Voltage and High-Power Chip Capacity Improvement Project of Yandong Co., Ltd.
Place of Implementation:Beijing China
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:1. The bidder or the bidder"s manufacturer must have the ability to produce defect scanning equipment for this bidding, and the bidder"s manufacturer must be able to provide effective after-sales service for the defect scanning of this bidding (the unit and contact information that provides after-sales service to Yandong).
2. The manufacturer of the bidder shall provide sales performance of 10 or more units of related or similar equipment in the past 3 years (from January 1, 2023 to present), and shall provide a supply list or a copy of the order or contract with official seal or authorized person"s signature (if only the supply list is provided, a commitment letter with official seal of the unit shall be provided to ensure the authenticity of the content).
3. The bidding product should be the bidder"s or its manufacturer"s own technical product. The bidding product may involve relevant patent content, and the bidder shall ensure that the tenderer is not held responsible for identifying and infringing on these patents.
4. The target equipment must be newly manufactured equipment, please provide a "commitment letter".
5. Original or photocopy of the credit certificate issued by the bidder"s bank within three months prior to the bid opening date (with the bidder"s company seal affixed to the photocopy);
6. Other qualification certification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-02-12
Ending of Selling Bidding Documents:2026-02-26
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Room 1601, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Price of Bidding Documents:￥800/$115
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-03-05 10:00
Place of Bid:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Place of Bid Opening:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Co., Ltd
Add.:51 Jinghai Fourth Road, Beijing Economic and Technological Development Zone
Contact:Mr. Wang Yu
Tel:+86-10-50973000-8107
Bidding Agency:Huacai Tendering Group
Add.:Room 1601, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Contact:Ms. Jia Dongmin
Tel:010-63509799-8013/8029
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):

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