Procurement of 1143-2540ZRGJ0076 Procurement of 8-inch Back Gold Evaporation Equipment for Shaanxi Electronic Chip Industry Era Technology Co., Ltd.s 8-inch High PerformanceCharacteristicProcessSemiconductorChipProductionLineProject(1) (Китайская Народная Республика - Тендер #69286625)

Procurement of 1143-2540ZRGJ0076 Procurement of 8-inch Back Gold Evaporation Equipment for Shaanxi Electronic Chip Industry Era Technology Co., Ltd."s 8-inch High PerformanceCharacteristicProcessSemiconductorChipProductionLineProject(1)

2025-12-16

【Buy Bidding Documents】

Shaanxi Zhongrun International Tendering Co.,ltd entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2025-12-16
1、Bidding Conditions
Overview:8-inch back gold evaporation equipment
Source of Funds:It has been implemented
Description of The Prepared Bidding Conditions:Have
2、Bidding Content
Bidding No:1143-2540ZRGJ0076
Project Name:Procurement of 8-inch Back Gold Evaporation Equipment for Shaanxi Electronic Chip Industry Era Technology Co., Ltd."s 8-inch High PerformanceCharacteristicProcessSemiconductorChipProductionLineProject
Place of Implementation:Shaanxi Province, China
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:3.1.1 Bidders within the territory of the People"s Republic of China must provide a business license with a unified social credit code (bidders outside the People"s Republic of China should have relevant registration and business certification documents);
3.1.2 Bidders shall have the necessary equipment technical support and service capabilities to fulfill the contract (provide supporting materials or commitment letters, and the format of the commitment letter shall be provided by themselves);
3.1.3 If the bidder is an agent bidding, the original authorization letter issued by the manufacturer for this project must be provided. Only one supplier of the same brand can participate in the bidding;
3.1.4 The bidder must possess the manufacturing or sales qualification for the equipment being bid on. The manufacturer must have a domestic installation track record of ≥50 units of the same model in 8-inch semiconductor wafer manufacturing/packaging plants (excluding solar photovoltaic plants, display panel plants, battery manufacturing plants, research institutions, universities, etc.) within the past three years (valid within 36 months prior to the bid submission deadline, subject to the signing time of the contract or order by the first party);
3.1.5 The bidder shall provide the original authorization letter from the unit leader and a copy of the authorized person"s ID card;
3.1.6 The bidder shall provide a credit certificate issued by a bank within the past three months;
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-12-16
Ending of Selling Bidding Documents:2025-12-23
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:12th Floor, Block A, Wangzuo International City, No. 1 Tangyan Road, High-tech Zone, Xi "an City
Price of Bidding Documents:￥1000/$150
Additional Instructions:The scanned copies of the documents required for bidder qualification with the official seal should be sent to the email of the bidding agency (zhongrun@sxzrzb.com) to obtain the remittance account of the bidding document fee. The tendering agency only conducts a preliminary review of the qualification proof materials provided by potential bidders and does not take it as the final review. The final qualification review will be conducted by the bid evaluation committee during the bid evaluation.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-01-06 09:30
Place of Bid:12th Floor, Block A, Wangzuo International City, No. 1 Tangyan Road, High-tech Zone, Xi "an City
Place of Bid Opening:12th Floor, Block A, Wangzuo International City, No. 1 Tangyan Road, High-tech Zone, Xi "an City
6、Contact Details
Purchasers:Shanxi Electronic Chip Industry Era Technology Co., Ltd
Add.:No. A2101-1, Phase I, Bonded Warehouse, North of Zong SAN Road, Comprehensive Bonded Zone, High-tech Zone, Xi "an City, Shaanxi Province
Contact:Liu Le
Tel:029-85727929
Bidding Agency:Shaanxi Zhongrun International Tendering Co.,ltd
Add.:12th Floor, Block A, Wangzuo International City, No. 1 Tangyan Road, High-tech Zone, Xi "an City
Contact:Mrs Zhang, Mrs Peng, Mr Liu
Tel:029-88825655
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):

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