Procurement of 0610-2542IH011967 Procurement of High-energy ion implantation machine for 12-inch Semiconductor IC Wafer of YDMT(1) (Китайская Народная Республика - Тендер #68831466)

Procurement of 0610-2542IH011967 Procurement of High-energy ion implantation machine for 12-inch Semiconductor IC Wafer of YDMT(1)

2025-11-27

【Buy Bidding Documents】

Beijing International Tendering Co.,Ltd. entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2025-11-27
1、Bidding Conditions
Overview:Procurement of High-energy ion implantation machine for 12-inch Semiconductor IC Wafer of YDMT
Source of Funds:Self-raised funds , and have been raised
Description of The Prepared Bidding Conditions:The project has met the bidding conditions
2、Bidding Content
Bidding No:0610-2542IH011967
Project Name:Procurement of High-energy ion implantation machine for 12-inch Semiconductor IC Wafer of YDMT
Place of Implementation:Beijing, P.R. China
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:Qualification criteria:
1. The manufacturer of the bidder must have the ability to produce the equipment for this bidding. The bidder shall provide a performance record of supplying no less than 10 identical or similar 12 inch high-energy ion implantation equipment from November 1, 2022 to present, and shall provide relevant supporting documents such as supply lists, contracts, orders, or acceptance certificates.
2. The bidder is able to provide effective after-sales service for the bidding equipment (including the unit and contact information that provides after-sales service to Yandong).
3. The target equipment must be brand new, please provide a "commitment letter".
4. The bidding product should be the bidder"s or its manufacturer"s own technical product. The bidding product may involve relevant patent content, and the bidder shall ensure that the tenderer is not held responsible for identifying and infringing on these patents.
5. Original or photocopy of the credit certificate issued by the bidder"s bank within three months prior to the bid opening date (with the bidder"s company seal affixed to the photocopy);
6. Other qualification certification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-11-27
Ending of Selling Bidding Documents:2025-12-04
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Room 509, Beijing International Tendering Co., Ltd.
Price of Bidding Documents:￥3000/$450
Additional Instructions:1. Time for selling bidding documents: 9:00-11:30am, 13:30-17:00pm (Beijing Time) on working days. 2. An
ext ra of RMB 100.00 for domestic bidders and USD 50.00 for foreign bidders shall be added for mail service. 3. If you buy bidding documents by way of TT, please indicate "0610-2542IH011967" when remitting your money. Price for Bidding Documents is ￥3000/$450. And please send the remittance details (bank voucher/slip) to liyan02@zgcgroup.com.cn.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-12-18 10:00
Place of Bid:Room 303, Beijing International Tendering Co., Ltd.
Place of Bid Opening:Room 303, Beijing International Tendering Co., Ltd.
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Technology Co., Ltd.
Add.:No. 51, Jinghai Silu, Economic and Technological Development Zone of Beijing
Contact:Mr. Wang Yu
Tel:+86-10-50973000-8107
Bidding Agency:Beijing International Tendering Co.,Ltd.
Add.:No.71 Beixiaojie (North Alley), Chaoyangmen, Dongcheng District, Beijing, P.R. China (100010)
Contact:Ms. Li Yan
Tel:010-84046625;liyan02@zgcgroup.com.cn
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):

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