Procurement of 0664-2540SUMECK27 Multi-channel wafer surface defect scanner(2) (Китайская Народная Республика - Тендер #68637352)

Procurement of 0664-2540SUMECK27 Multi-channel wafer surface defect scanner(2)

2025-11-19

【Buy Bidding Documents】

SUMEC INTERNATIONAL TECHNOLOGY CO., LTD. entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2025-11-19
1、Bidding Conditions
Overview:Multi-channel wafer surface defect scanner
Source of Funds:Prepared
Description of The Prepared Bidding Conditions:Prepared
2、Bidding Content
Bidding No:0664-2540SUMECK27
Project Name:Multi-channel wafer surface defect scanner
Place of Implementation:NINGBO
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:More details in the Chinese version of the tendering document
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-11-19
Ending of Selling Bidding Documents:2025-11-26
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:More details in the Chinese version of the tendering document
Price of Bidding Documents:￥800/$115
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-12-10 14:00
Place of Bid:More details in the Chinese version of the tendering document
Place of Bid Opening:More details in the Chinese version of the tendering document
6、Contact Details
Purchasers:CLP compound semiconductor co., LTD
Add.:NINGBO
Contact:Mr Sun
Tel:15150596501
Bidding Agency:SUMEC INTERNATIONAL TECHNOLOGY CO., LTD.
Add.:Nanjing
Contact:Deng Mengshi
Tel:025-84531619,dms@sumec.com.cn
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):

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