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Procurement of 1354-254HXZBG2506 Zhengzhou Xinghang Technology Co., LTD. 12-inch Wafer Silver Paste Bonder Purchase Project(1) (Китайская Народная Республика - Тендер #68494516)


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Страна: Китайская Народная Республика (другие тендеры и закупки Китайская Народная Республика)
Номер конкурса: 68494516
Дата публикации: 13-11-2025
Источник тендера:


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Procurement of 1354-254HXZBG2506 Zhengzhou Xinghang Technology Co., LTD. 12-inch Wafer Silver Paste Bonder Purchase Project(1)

2025-11-13
hengxinzixunguanliyouxiangongsi entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2025-11-13
1、Bidding Conditions
Overview:Zhengzhou Xinghang Technology Co., Ltd. purchases 8 sets of 12-inch Wafer Silver Paste Bonder.
Source of Funds:Funded
Description of The Prepared Bidding Conditions:Fulfilled
2、Bidding Content
Bidding No:1354-254HXZBG2506
Project Name:Zhengzhou Xinghang Technology Co., LTD. 12-inch Wafer Silver Paste Bonder Purchase Project
Place of Implementation:Henan Province, China
List of Products:
NO. Product Name Quantity Main Technical Data Remarks
1 12-inch Wafer Silver Paste Bonder 8 sets This equipment is used for automatic film expansion, dispensing, bonding, inspection and other production and processing operations of wafers with a diameter of 12-inch or less in integrated circuit packaging

3、Qualification Requirements For Bidder
Qualifications or Performance:(1)For foreign enterprises, the relevant registered documents in accordance with the laws of the country (region) shall be provided that at the address of the main manufacturing plant; For domestic enterprises, a copy of the business license will be provided;
(2)In case the goods supplied by the bidder under the contract are not produced by the bidder himself, the bidder shall be requested to acquire the sole official authorization from the manufacturer for certifying whom agreed to supply the goods in this bid (original), in the form of Section4, Volume 1;
(3)Bidders shall provide an original or a copy of bank credit certificate issued by whose deposit bank within three months before bid opening date;
(4)Bidder"s Qualification Statement, in the form of Section4, Volume 1;
(5)Manufacturer"s Qualification Statement, in the form of Section4, Volume 1;
(6)Contractual Experience requirements:The model provided by the manufacturer is the mainstream model in the industry, and there are at least 15 transaction certificates of customers located in the mainland of China (the detailed supporting documents shall prevail).
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-11-13
Ending of Selling Bidding Documents:2025-11-20
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:6th floor, Block B, Building 16, Henan National University Science Park (East), Dianchang Road, Zhengzhou city.
Price of Bidding Documents:¥1000/$150
Additional Instructions:Potential bidders are accepted for bid registering with sending E-mail to the Tendering Agent Email Address(hxzx04@163.com) attaching relevant registered documents addressed on the main manufacturing plant or a copy of the business license; E-mail from potential bidders shall mark with bid project name and bid number; Potential bidders are required to complete the "Form of Bidding documents Procurement",and purchase the bidding document(remark the Remittance with "Bidding Documents fee of Xinghang 12-inch Wafer Silver Paste Bonder Purchase Project" ) and the deadline for receiving bidding documents is 17:00 p.m. on November 20th,2025.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-12-04 14:00
Place of Bid:Conference Room of Edpin Yue Hotel (Zhengzhou International Airport Branch) (Located at the southeast corner of the intersection of Xingang Avenue and Ruwu Road, Zhengzhou Airport Economy Zone).
Place of Bid Opening: Conference Room of Edpin Yue Hotel (Zhengzhou International Airport Branch) (Located at the southeast corner of the intersection of Xingang Avenue and Ruwu Road, Zhengzhou Airport Economy Zone).
6、Contact Details
Purchasers:Zhengzhou Xinghang Technology Co., LTD.
Add.:No. 156, Heming Street, Airport Economic Comprehensive Experimental Zone, Xinzheng City, Zhengzhou City, Henan Province
Contact:Mr. Zhao
Tel:+86-371--63373666-8018
Bidding Agency:hengxinzixunguanliyouxiangongsi
Add.:6th floor, block B, building 16, Henan national university science and technology park (east), Dianchang road, Zhengzhou city, Henan province
Contact:Ms. Wang & Ms. Li & Ms.Tian
Tel:+86-371-55131206
7、Remittance Approach:
Bank(RMB):China Construction Bank, Zhengzhou Huaqiang City Square Sub-branch
Bank(USD):Bank of Communications, Henan branch.
Account NO.(RMB):41050167283900000062
Account NO.(USD):411626999141000005780
Additional:(USD Account)swift:COMMCNSHZHE
Add. :129 Huayuan Road, Jinshui District, Zhengzhou City, Henan Province
8、Additional Instruction
Additional Instructions:The bidder needs to register before the tender on www.ebnew.com or www.chinabidding.com. And the evaluation results will be released on www.ebnew.com and www.chinabidding.com.


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