Procurement of 4197-2240HZHFC001/143 12 Inch Integrated Circuit Manufacturing Project of Hangzhou HFC Semiconductor Corp.(1) (Китайская Народная Республика - Тендер #61414261)

Procurement of 4197-2240HZHFC001/143 12 Inch Integrated Circuit Manufacturing Project of Hangzhou HFC Semiconductor Corp.(1)

2025-02-10

【Buy Bidding Documents】

China Electronics Commerce (Beijing) Co., Ltd entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2025-02-10
1、Bidding Conditions
Overview:12 Inch Integrated Circuit Manufacturing project
Source of Funds:OK
Description of The Prepared Bidding Conditions:OK
2、Bidding Content
Bidding No:4197-2240HZHFC001/143
Project Name:12 Inch Integrated Circuit Manufacturing Project of Hangzhou HFC Semiconductor Corp.
Place of Implementation:Hangzhou,Zhejiang, China
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:Bidders are legal persons or other organizations who participate in bidding. This Invitation for Bids is open to all suppliers from within the People"s Republic of China (hereinafter abb. as "PRC") and all countries/areas which have regular trade relations with PRC. Bidders must pay for the bidding documents and register for the record; otherwise the bidder has no qualification to attend the bid. Bidders shall have relevant sales shipping and acceptance record of of the same type"s equipment in 12 inch wafer FAB plants in the world, details see the document.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-02-10
Ending of Selling Bidding Documents:2025-02-17
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Bidding Documents Selling Counter, Building A, 17 Fuxing Road, Haidian District, Beijing, PRC
Price of Bidding Documents:￥1500/$250
Additional Instructions:Specific time of Selling Bidding Documents: between 9:00 ~11:30 am and 13:00~16:30 pm (Beijing Time)(except holidays).
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-03-04 10:00
Place of Bid:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, PRC
Place of Bid Opening:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, PRC
6、Contact Details
Purchasers:Hangzhou HFC Semiconductor Corp.
Add.:No 811, Dongken Road, Qiantang District CHI-310005 Hangzhou, Zhejiang, China
Contact:Mr.Tang
Tel:86-571-56381888 -10061
Bidding Agency:China Electronics Commerce (Beijing) Co., Ltd
Add.:Building A, 17 Fuxing Road, Haidian District, Beijing, PRC
Contact:Mr Zhang
Tel:010-52207785
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):

Еще тендеры и закупки за эти даты

10-02-2025 Procurement of 4197-214BOEMY0001/246 BOE MIANYANG G6 AMOLED(FLEXIBLE) Production Line Project(2).

10-02-2025 Procurement of 4197-214BOEMY0001/245 BOE MIANYANG G6 AMOLED(FLEXIBLE) Production Line Project(2).

10-02-2025 Procurement of 4197-214BOEMY0001/243 BOE MIANYANG G6 AMOLED(FLEXIBLE) Production Line Project(2).

10-02-2025 Procurement of 0623-2540J1110032 Yixing CRRC Times Semiconductor Co., LTD. Automatic silver sintering equipment (soft) project (re-bidding)(2).

10-02-2025 Procurement of 0811-254DSITC0128 Electronic gastrointestinal endoscopy system and mirror(1).

10-02-2025 Procurement of 4197-2240HZHFC001/144 12 Inch Integrated Circuit Manufacturing Project of Hangzhou HFC Semiconductor Corp.(1).