Procurement of 1289-244024ZB2029 Yandong Technology semiconductor integrated circuit chemical mechanical polishing equipment procurement(1) (Китайская Народная Республика - Тендер #59743342)

Procurement of 1289-244024ZB2029 Yandong Technology semiconductor integrated circuit chemical mechanical polishing equipment procurement(1)

2024-12-09

【Buy Bidding Documents】

Huacai Tendering Group entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2024-12-09
1、Bidding Conditions
Overview:Yandong Technology semiconductor integrated circuit chemical mechanical polishing equipment procurement
Source of Funds:Implemented
Description of The Prepared Bidding Conditions:Already equipped
2、Bidding Content
Bidding No:1289-244024ZB2029
Project Name:Yandong Technology semiconductor integrated circuit chemical mechanical polishing equipment procurement
Place of Implementation:Beijing China
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:1. The bidder must have the ability to produce the chemical mechanical polishing equipment for this bidding, and be able to provide effective after-sales service for the equipment (providing service units and contact information).
2. Bidders shall provide their supply performance in the past 3 years (from December 1, 2021 to present), with actual sales performance of 30 or more units of the same or similar equipment (including no less than 20 units of 12 inch equipment). Contracts or orders in the form of trials or demos are not recognized, and copies of contracts or orders stamped with official seals or signed by authorized persons must be provided.
3. The bidding product should be the bidder"s own technical product. The bidding product may involve relevant patent content, and the bidder shall ensure that the tenderer is not held responsible for identifying and infringing on these patents.
4. Original or photocopy of the credit certificate issued by the bidder"s bank within three months prior to the bid opening date (with the bidder"s company seal affixed to the photocopy);
5. Other qualification certification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2024-12-09
Ending of Selling Bidding Documents:2024-12-16
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Room 2010, 20 / F, Building C, Zhongguancun East Road, Haidian District, Beijing
Price of Bidding Documents:￥800/$120
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2024-12-31 10:00
Place of Bid:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Place of Bid Opening:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Technology Co., Ltd.
Add.:51 Jinghai Fourth Road, Beijing Economic and Technological Development Zone
Contact:Mr. Wang Yu
Tel:+86-10-509730008107
Bidding Agency:Huacai Tendering Group
Add.:Room 1601, Building 6, Guotou Wealth Plaza, No. 9 Guang"an Road, Fengtai District, Beijing
Contact:Ms. Jia Dongmin
Tel:010-63509799-8013/8029
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):

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