Procurement of 0613-244025125013 Xinlian Microelectronics Company Limited Cu loop Single Wafer Clean Tool and Al solvent single wafer clean(1) (Китайская Народная Республика - Тендер #59670709)

Procurement of 0613-244025125013 Xinlian Microelectronics Company Limited Cu loop Single Wafer Clean Tool and Al solvent single wafer clean(1)

2024-12-06

【Buy Bidding Documents】

Shanghai Machinery & Electric Equipment Tendering Co.,Ltd. entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2024-12-06
1、Bidding Conditions
Overview: Xinlian Microelectronics Company Limited Cu loop Single Wafer Clean Tool and Al solvent single wafer clean
Source of Funds:Now Funds have been put in place, the Project is with the bidding conditions.
Description of The Prepared Bidding Conditions:Now Funds have been put in place, the Project is with the bidding conditions.
2、Bidding Content
Bidding No:0613-244025125013
Project Name:Xinlian Microelectronics Company Limited Cu loop Single Wafer Clean Tool and Al solvent single wafer clean
Place of Implementation:Chongqing, China
List of Products:

3、Qualification Requirements For Bidder
Qualifications or Performance:Invitation for Bids is open to all suppliers from within the People"s Republic of China (hereinafter abb. as "PRC") and all countries/areas which have regular trade relations with PRC. Bidders must pay for the bidding documents and register for the record; otherwise the bidder has no qualification to attend the bid.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2024-12-06
Ending of Selling Bidding Documents:2024-12-13
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:MEETC, 20F Hengda Plaza 285 Changshou Road, Shanghai, PRC.
Price of Bidding Documents:￥3000/$450
Additional Instructions:On-site registration with a copy of the business license and the original authorization letter of the legal representative to the registration office.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2024-12-27 09:00
Place of Bid:MEETC, 10F Hengda Plaza 285 Changshou Road, Shanghai, PRC.
Place of Bid Opening:MEETC, 10F Hengda Plaza 285 Changshou Road, Shanghai, PRC.
6、Contact Details
Purchasers:Xinlian Microelectronics Co.,Ltd.
Add.:Room 601-A153, SOHO Building, No. 28-2 Xiyong Avenue, Xiyong Street, High tech Zone, Chongqing
Contact:Mr Huang
Tel:023-61386888
Bidding Agency:Shanghai Machinery & Electric Equipment Tendering Co.,Ltd.
Add.:MEETC, 10F Hengda Plaza 285 Changshou Road, Shanghai, PRC.
Contact:Mr CHEN Ms. Jiang. Mr LU
Tel:+86-21-32557515
7、Remittance Approach:
Bank(RMB):China Construction Bank Shanghai Branch, Banking Department
Bank(USD):China Construction Bank Shanghai Branch, Banking Department
Account NO.(RMB):31001550400055646341
Account NO.(USD):31001550400055646341

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