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Procurement of 4197-2140BOETRI02/08 Equipment Procurement Project of RTA and AMOLED(1) (Китайская Народная Республика - Тендер #59633590) | ||
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Страна: Китайская Народная Республика (другие тендеры и закупки Китайская Народная Республика) Номер конкурса: 59633590 Дата публикации: 06-12-2024 Источник тендера: www.chinabidding.com |
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Procurement of 4197-2140BOETRI02/08 Equipment Procurement Project of RTA and AMOLED(1)
| NO. | Product Name | Quantity | Main Technical Data | Remarks |
| 4197-2140BOETRI02/08 | Wafer Bonding | 1 | The equipment is a fully automatic system.The equipment is mainly used for processes such as adhesive bonding, metal bonding, between multiple wafers and 110mm*110mm,155mm*160mm glass substrates simultaneously;The equipment main body includes three modules: EFEM (device front end), TM (transmission module) and PM (process module). The EFEM module is mainly responsible for loading the wafer from various handling equipment in the semiconductor plant into the bonding equipment; the TM module is mainly responsible for the transmission of the wafer inside the bonding equipment; the PM is the actual bonding module of the wafer. EFEM is equipped with three Load Port (wafer loader) for placing the upper wafer, the lower glass substrate, and bonding the rear wafer pairs.The equipment is equipped with a loading chamber and a Unloading chamber ,two bonding chambers, one chamber only for resin material bonding and one chamber only for metal bonding. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service. | CNY1500/USD250 |