China Electronics Commerce (Beijing) Co., Ltd entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by
way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2024-12-06
1、Bidding Conditions
Overview:Equipment Procurement Project of RTA and AMOLED
Source of Funds:OK
Description of The Prepared Bidding Conditions:OK
2、Bidding Content
Bidding No:4197-2140BOETRI02/08
Project Name:Equipment Procurement Project of RTA and AMOLED
Place of Implementation:Beijing, P. R. China
List of Products:
NO.
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Product Name
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Quantity
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Main Technical Data
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Remarks
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4197-2140BOETRI02/08
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Wafer Bonding
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1
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The equipment is a fully automatic system.The equipment is mainly used for processes such as adhesive bonding, metal bonding, between multiple wafers and 110mm*110mm,155mm*160mm glass
substrates simultaneously;The equipment main body includes three modules: EFEM (device front end), TM (transmission module) and PM (process module). The EFEM module is mainly
responsible for loading the wafer from various handling equipment in the semiconductor plant into the bonding equipment; the TM module is mainly responsible for the transmission of
the wafer inside the bonding equipment; the PM is the actual bonding module of the wafer. EFEM is equipped with three Load Port (wafer loader) for placing the upper wafer, the lower
glass substrate, and bonding the rear wafer pairs.The equipment is equipped with a loading chamber and a Unloading chamber ,two bonding chambers, one chamber only for resin material
bonding and one chamber only for metal bonding. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The
action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be
artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service.
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CNY1500/USD250
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3、Qualification Requirements For Bidder
Qualifications or Performance:Bidders are legal persons or other organizations who participate in bidding. This Invitation for Bids is open to all suppliers from within the People"s Republic
of China (hereinafter abb. as "PRC") and all countries/areas which have regular trade relations with PRC. Bidders must pay for the bidding documents and register for the record, otherwise the
bidder has no qualification to attend the bid.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2024-12-06
Ending of Selling Bidding Documents:2024-12-13
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China or CEC E-procurement Platform(https://www.cec-ec.com.cn)
Price of Bidding Documents:¥1500/$250
Additional Instructions:Price of Bidding Documents see List of Products;Specific time of Selling Bidding Documents:between 9:00 ~11:30 am and 13:00~16:30 pm (Beijing Time)(except
holidays).The bidder should register on the website of CEC E-procurement Platform (https://www.cec-ec.com.cn) to purchasing and download the bidding documents.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2024-12-27 10:00
Place of Bid:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
Place of Bid Opening:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
6、Contact Details
Purchasers:BOE
Add.:NO.9, Dize Rd, BDA,Beijing, 100176, China
Contact:Mr. Li
Tel:86-10-57675680
Bidding Agency:China Electronics Commerce (Beijing) Co., Ltd
Add.:Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
Contact:Mr. Liu, Ms. Chang, Mr. Zhao
Tel:86-10-52200340 (Sell bidding documents), 86-10-52207732
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):